Samsung invests $15.2 million to expand semiconductor packaging at Suzhou plant
Published on: 2024-11-22
category: تقنية
Samsung is increasing its investment in domestic and overseas production facilities to enhance its advanced semiconductor packaging capabilities, according to Chinese media outlet Jiwei. As in-house packaging processes for next-generation high-bandwidth memory (HBM) products, such as HBM4, become increasingly critical, Samsung aims to improve its packaging technology to remain competitive and close the gap with […]
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Samsung is increasing its investment in domestic and overseas production facilities to enhance its advanced semiconductor packaging capabilities, according to Chinese media outlet Jiwei. As in-house packaging processes for next-generation high-bandwidth memory (HBM) products, such as HBM4, become increasingly critical, Samsung aims to improve its packaging technology to remain competitive and close the gap with […]