TSMC to receive first High NA EUV lithography machine by end of year

TSMC to receive first High NA EUV lithography machine by end of year
TSMC aims to promote mass production of the second generation of 3nm chips (N3E process) in 2024.TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography machine by the end of 2024, according to Japanese media outlet Nikkei Asia. Each High NA EUV machine costs over $350 million and will enable semiconductor makers to produce smaller chips. Although High NA EUV offers finer resolution […]

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