Intel China announces the expansion of its Chengdu packaging and testing facility

Intel China announces the expansion of its Chengdu packaging and testing facility
Intel’s Nova Lake processor to adopt TSMC 2nm process technologyIntel announced in Beijing that it will expand its Chengdu packaging and testing facility, making the capital of southwest China’s Sichuan province its supply chain base. The facility will package and test chips and work to improve support for Chinese customers. Intel remarked that “Chengdu, as a key city driving high-quality development in the western […]

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