Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset

Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset
The powerful 3nm Dimensity 9400 chipset and advanced imaging capabilities position Vivo as a major player in the high-end smartphone market.On Monday, Chinese tech firm Vivo unveiled its new X200 series flagship smartphones, including the X200, X200 Pro, and X200 Pro Mini, at the National Aquatics Center in Beijing. Vivo also announced a joint lab with Arm and collaboration with MediaTek to make a second-generation 3nm Dimensity 9400 chipset for the devices. The premium model, […]

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