Samsung and TSMC to co-develop HBM4 AI chip, mass production expected in 2025
Published on: 2024-09-10
category: تقنية
Samsung is partnering with its foundry rival TSMC to jointly develop the bufferless HBM4, a next-generation AI chip, Dan Kochpatcharin, head of Ecosystem and Alliance Management at TSMC, said during the Semicon Taiwan 2024 forum last week. High-bandwidth memory (HBM) is crucial for AI due to its superior processing speed compared to traditional DRAM (dynamic […]
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Samsung is partnering with its foundry rival TSMC to jointly develop the bufferless HBM4, a next-generation AI chip, Dan Kochpatcharin, head of Ecosystem and Alliance Management at TSMC, said during the Semicon Taiwan 2024 forum last week. High-bandwidth memory (HBM) is crucial for AI due to its superior processing speed compared to traditional DRAM (dynamic […]