TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow
Published on: 2024-08-19
category: تقنية
TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first European 12-inch plant in Dresden, Germany, according to the Taiwanese media outlet Economic Daily News. The facility, with an initial monthly capacity of 40,000 wafers, will introduce 28/22nm planar CMOS […]
promo text article page promo link article page.
back_to_articles_list