TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow

TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow
TSMC aims to promote mass production of the second generation of 3nm chips (N3E process) in 2024.TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first European 12-inch plant in Dresden, Germany, according to the Taiwanese media outlet Economic Daily News. The facility, with an initial monthly capacity of 40,000 wafers, will introduce 28/22nm planar CMOS […]

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